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24th IEEE European Test Symposium
(ETS'19)
May 27 -– 31, 2019
Baden Baden, Germany

https://www.testgroup.polito.it/ets19/
CALL FOR PAPERS

About


Submissions: http://welcome.molesystems.com/tttc/ETS/2019/

The IEEE European Test Symposium (ETS) is Europe's premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing, reliability, security and validation. 

In 2019, ETS will take place in the Congress Center in Baden-Baden. It is organized by the Karlsruhe Institute of Technology (KIT), which co-sponsors the event jointly with the IEEE Council on Electronic Design Automation (CEDA). A Test Spring School will be organized in conjunction with ETS'19.


NEW Initiatives at ETS'19


Student activities and promotions:

  • Heavily discounted student registration rate: The organizing committee of ETS'19 is proud to offer extremely low rates for student participation. The student registration rate is reduced to less than half of previous years' rate. The advanced IEEE member student rate is only 150 Euros.
  • Bundle TSS and ETS rates for student participants: With the help of sponsors for TSS, we are able to provide a very low rate for the students to attend both TSS and ETS events. The bundle registration rate is as low as 400 Euros for students attending both TSS and ETS. 
New Submission categories:
  • Embedded Workshop: The ETS embedded workshop provides a forum for work in progress as well as for case studies. Workshop sessions are characterized by an intensive interaction with the audience and lively discussions. Prospective presenters are invited to submit an extended abstracts of 2 to 4 pages.
  • PhD forum:  The PhD forum provides an excellent opportunity for PhD students to present their ongoing work and get feedback from experts in the field. The forum will be organized as a special poster session in an attractive time slot.

Scope

You are invited to participate and submit your contributions to ETS'19. The areas of interest include (but are not limited to) the following topics:

  • Analog, Mixed-signal and RF Test
  • ATE Hardware and Software
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • Current-Based Test
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design for Test (DFT)
  • Design for Manufacturing (DFM)
  • Design Verification and Validation
  • Diagnosis and Silicon Debug
  • Economics of Test
  • Failure Analysis
  • Fault Modeling and Simulation
  • Fault Tolerance
  • Hardware Trojans
  • Hardware Security
  • High-Speed I/0 Test
  • GPU Test
  • Low-Power IC Test
  • Memory Test and Repair
  • MEMS Test
  • Microprocessor Test
  • Multi-/Many-core Processor Test
  • Nanotechnology Test
  • On-line Test
  • Power Issues in Test
  • Design for Reliability
  • Reliability-Security Trade-offs
  • Security Issues in Test
  • Self-Repair
  • Signal Integrity Test
  • Stacked or 3D ICs Test
  • Standards in Test
  • System Test
  • SiP and SoC Test
  • Test Synthesis
  • Test, Reliability and Security of Emerging Technologies and Architectures
  • Test of Reconfigurable Systems
  • Test Quality
  • Thermal Issues in Test
  • Transient and Soft Errors
  • Variability Issues in Test
  • Yield Analysis and Enhancement
Publications: ETS'19 will produce Formal Proceedings of scientific papers as well as an Informal Digest of papers including additional material. 

The Best Paper Award of ETS'19 will be presented at ETS'20.

Submissions

ETS'19 seeks original, unpublished contributions of the following types:

  • Scientific papers for the Formal Proceedings, presenting novel and complete research work.
  • Extended Abstracts for Embedded Workshop papers including "work in progress" and "case studies".
  • Contributions for the PhD forum (deadline in March 2019).
  • Contributions for ETS2.
  • Proposals for panels, embedded tutorials, and other special sessions.
  • Vendor presentations focusing on new features of test related products.
Detailed submission information and guidelines are posted on the ETS'19 web page.

The ETS'19 organizing committee strongly encourages the organization of fringe meetings and workshops. Details can be found on the ETS'19 web page. 

Key Dates


Submission deadline: December 11, 2018

Notification of acceptance: February 15, 2019

Camera-ready manuscript: March 22, 2019
Additional Information

Mehdi Tahoori – General Chair

Karlsruhe Institute of Technology

E-Mail: mehdi.tahoori@kit.edu

Sybille Hellebrand – Program Chair

Paderborn University

E-Mail: sybille.hellebrand@uni-paderborn.de
Committee

ORGANIZING COMMITEE

General Chair

  • Mehdi Tahoori (DE)

Vice General Chairs

  • Artur Jutman (EE)
  • Jaan Raik (EE)

Program Chair

  • Sybille Hellebrand (DE)

Vice Program Chair

  • Görschwin Fey (DE)

Local and Financial Chair

  • Iris Schroeder-Piepka (DE)

Topic Chairs

  • Paolo Bernardi (IT)
  • Alberto Bosio (FR)
  • Artur Jutman (EE)
  • Martin Keim (US)
  • Régis Leveugle (FR)
  • Maria Michael (CY)
  • Ilia Polian (DE)
  • Christoph Scholl (DE)
  • Haralampos Stratigopoulos (FR)
  • Ioana Vatajelu (FR)

ETS2 Special Track Chairs

  • Rene Segers (NL)
  • Zebo Peng (SE)

Embedded Workshop Chairs

  • Pete Harrod (UK)
  • Gildas Leger (ES)

Panels Chairs

  • Jeff Rearick (US)
  • Matteo Sonza Reorda (IT)

Embedded Tutorials Chairs

  • Lorena Anghel (FR)
  • Teresa McLaurin (US)

Special Sessions Chairs

  • Bernd Becker (DE)
  • Krish Chakrabarty (US)

PhD Forum Chairs

  • Liviu Miclea (RO)
  • Ernesto Sanchez (IT)

Industrial Relations Chairs

  • Hans Manhaeve (BE)
  • Jürgen Schlöffel (DE)

Publications and Review Chair

  • Giorgio Di Natale (FR)

Publicity Chairs

  • Stefano Di Carlo (IT)
  • Michiko Inoue (JP)

Web Chair

  • Alessandro Savino (IT)

Awards Chairs

  • Peter Maxwell (US)
  • Jerzy Tyszer (PL)

ETS Fringe Workshops Chairs

  • Maxim Jenihhin (EE)
  • Erik Larsson (SE)

Regional Liaisons Chairs

Asia:

  • James Chien-Mo Li (TW)
  • Huawei Li (CN)

South Pacific:

  • A. Osseiran (AU)

India:

  • Virendra Singh (IN)

South America: 

  • Letitia Pöhls (BR)

North America: 

  • Adit Singh (US)
  • Nicola Nicolici (CA)

TSS Chairs

  • Lorena Anghel (FR)
  • Sybille Hellebrand (DE)

TSS Local Arrangements Chair

  • Dennis Gnad (DE)

STEERING COMMITTEE

  • Matteo Sonza-Reorda (IT) – Chair
  • Lorena Anghel (FR)
  • Bernd Becker (DE)
  • Rolf Drechsler (DE)
  • Stephan Eggersglüß (DE)
  • Joan Figueras (ES)
  • Patrick Girard (FR)
  • Said Hamdioui (NL)
  • Pete Harrod (GB)
  • Sybille Hellebrand (DE)
  • Artur Jutman (EE)
  • Hans Manhaeve (BE)
  • Erik Jan Marinissen (BE)
  • Maria Michael (CY)
  • Liviu Miclea (RO)
  • Zebo Peng (SE)
  • Jaan Raik (EE)
  • Michel Renovell (FR)
  • Jochen Rivoir (DE)
  • Mehdi Tahoori (DE)
  • Hans-Joachim Wunderlich (DE)
  • Yervant Zorian (US)
For more information, visit us on the web at: https://www.testgroup.polito.it/ets19/

The 24th IEEE European Test Symposium is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).
IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI
Politecnico di Torino - Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR
Synopsys, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

  

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

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